PART |
Description |
Maker |
FDMF8700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
MMO-6SF MBB-2 MBB-6 |
Multi-Mod 6 zone interface module
|
Gamewell-FCI by Honeywell Gamewell-FCI by Honeywe...
|
IRS2130DJ IRS21303DJ IRS2132DJ IRS2132DJPBF |
3 Phase Driver, Inverting Input, 2.5us Deadtime in a mod. 44-lead PLCC package 3 Phase Driver, Inverting Input, 0.8us Deadtime 13-20 Vout in a mod. 44-lead PLCC package 3 Phase Driver, Inverting Input, 0.8us Deadtime in a mod. 44-lead PLCC package
|
International Rectifier
|
IRS2135DJPBF |
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a mod. 44-lead PLCC package
|
International Rectifier
|
D1034UK |
METAL GATE RF SILICON FET(GOLD METALLISED MULTI-PURPOSE SILICON DMOS RF FET 80W - 28V - 500MHz PUSH-PULL)
|
SEME-LAB[Seme LAB]
|
M36L0T7050B2 M36L0T7050B2ZAQ M36L0T7050B2ZAQE M36L |
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
|
Numonyx B.V
|
ISL24003IRZ-T7 ISL24003IRZ ISL24003 |
Multi-Channel Buffers Plus VCOM Driver BUFFER AMPLIFIER, QCC44 Multi-Channel Buffers Plus VCOM Driver(多通道缓冲器和VCOM驱动
|
Intersil, Corp. Intersil Corporation
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
D2224UK |
Gold Metallised Multi-Purpose Silicon DMOS RF FET(5W-7.2V-850MHz,Single Ended)(镀金多用DMOS射频硅场效应5W-7.2V-850MHz,单端) METAL GATE RF SILICON FET
|
Semelab(Magnatec) SEME-LAB[Seme LAB]
|